Discover the new solder balls developed by HEF

The French HEF Group has developed and markets an innovative solution of soft-core polymer solder balls (PCSB), enabling reliable, high-performance assembly of electronic components for all types of applications (aeronautics, space, weapons, mobility, etc.).

Advantages of polymer-core solder balls:

Our scientific know-how combined with our industrial capacity will enable you to make three major gains:

1) Technical: Increased resistance to thermomechanical stresses compared with standard solutions.

2) Environmental: Lead-free solder balls also save weight.

3) Versatility: Compatible with reflow processes (IPC J-STD-001) and lead-free solder pastes.