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Materials

Dicing of wafers and silicon substrates

Découpe sur wafers
Découpe sur wafers

Description

We offer the dicing of the wafers in square or rectangular parts.

Examples:

  • 10 mm x 10 mm
  • 5 mm x 5 mm
  • 5 mm x 10 mm, ...
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  • Our standards
  • Description
  • Linked products

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Description

We offer the dicing of the wafers in square or rectangular parts.

Examples:

  • 10 mm x 10 mm
  • 5 mm x 5 mm
  • 5 mm x 10 mm, ...

Linked products

Our Silicon wafers
Silicon wafers

Our Silicon wafers

Diamond Scribes
Cutting

Diamond Scribes

Diamond Scribe Refill
Cutting

Diamond Scribe Refill


If you want an offer, or more information on this product, contact us:

+33 (0)1 41 90 50 50 Write to us

Fast delivery
in France and Europe

ISO 9001
and 14001 certifications

Service / Maintenance of
mechanical components