Materials
Bonding Wire
Description
Please specify the length and the number of spools required on the quantity box. Refer to all technical information on the pdf file (tab Downloads).
This product is available in 6 versions
See our references- Our standards
- Description
- Downloads
- Linked products
Our standards
Material | Ø Wire | Quantity | |
---|---|---|---|
MaterialGold bonding | Ø Wirefrom 15 ±1 µm to 38 ±1 µm | Quantity | Add to cart |
MaterialGold alloy | Ø Wirefrom 15 µm to 30 µm | Quantity | Add to cart |
MaterialCopper | Ø Wirefrom 15 ±1 µm to 500 ±10 µm | Quantity | Add to cart |
MaterialAluminum-Silicon | Ø Wirefrom 18 ±1 µm to 80 ±3 µm | Quantity | Add to cart |
MaterialSilver Alloy | Ø Wirefrom 15 µm to 30 µm | Quantity | Add to cart |
MaterialAluminum (for power devices) | Ø Wirefrom 100 ±5 µm to 500 ±10 µm | Quantity | Add to cart |
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Description
Please specify the length and the number of spools required on the quantity box. Refer to all technical information on the pdf file (tab Downloads).
Downloads
Datasheets
TDS-Tanaka-Bonding-wires.pdfLinked products
Gold bonding wire, Au
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mechanical components